منابع مشابه
Solder Joint Reliability Analysis and Testing
QFN packages have become mainstream designs for mobile applications. As more applications adopt the QFN style packages, I/O count requirements are increasing. The typical method for increasing pin count in a QFN package is to increase the body size to accommodate the additional lead fingers. This is undesirable though, as mobile device users are pushing for smaller package sizes. By using a dua...
متن کاملStacked solder bumping technology for improved solder joint reliability
Reliability in flip chip and Ball Grid Array is a major concern. Solder joint geometry is extremely important from a reliability point of view. Commonly, the flip chip solder bump takes on the shape of a spherical segment. Mathematical calculations and finite element modeling have shown that the hourglass-shaped solder bumps experience the lowest plastic strain and have the longest lifetime. In...
متن کاملLead-free Solder Joint Quality Investigation
New Pb-free materials ask thorough verification because their properties as wetting, solderability and mechanical properties are different from these SnPb. In this paper are presented some new facts from creep and stress relaxation investigation including new arrangement for measurement. Results from creep, stress, shear and bend testing are presented for three types of solder (Sn/3.5Ag, Sn/3.8...
متن کاملCree XLamp LEDs Solder Joint Reliability Study
Copyright © 2013-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. ENERGY STAR® is a registered trademark of the U.S. Environmental Protection Agency. Other trademarks, product, and company names are the property of their respective owners and do not...
متن کاملA Study of Solder Joint Failure Criteria
One of the challenges in an experimental study of solder joint reliability is to determine when cracks occur in a solder joint or when a solder joint fails. Cracks in a real solder joint are difficult to identify using an X-Ray system. Cross-sectioning and scanning electron microscopy (SEM) is a destructive method. A common non-destructive test method is to monitor resistance increase in a sold...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of Electronic Packaging
سال: 1992
ISSN: 1043-7398,1528-9044
DOI: 10.1115/1.2905434